Nuoxing Advanced Material Co., Ltd. (Nuoxing Technology) is a renowned high-tech company specializing in the research, development, and production of advanced coating materials, including high purity silicon dioxide (SiO2) sputtering targets. With over two decades of experience and a strong foundation in innovation, Nuoxing provides custom solutions for complex thin-film deposition applications across flat panel displays, semiconductors, optoelectronics, photovoltaics, and more.
High purity SiO2 targets produced by Nuoxing are characterized by their superior chemical and structural uniformity, extremely low levels of impurities, and dense microstructure. These attributes are crucial for achieving films with high transparency, strong adhesion, and optimal dielectric properties, meeting the demands of next-generation electronic and optical devices. Quality is further ensured through rigorous analytical controls and the use of proprietary purification and shaping technologies.
A significant application for Nuoxing's SiO2 sputtering targets is their integration with the Leybold DEMOS400 series backplate. Bonding the SiO2 target to the DEMOS400 backplate requires precision to ensure uniform heat dissipation and mechanical stability during thin film deposition processes, such as physical vapor deposition (PVD). Nuoxing utilizes advanced bonding techniques and tailor-made backplates to guarantee compatibility with Leybold systems, offering strong adhesion, enhanced thermal conductivity, and long operational lifespans. This results in superior process reliability, higher yields, and consistent film properties demanded by modern manufacturing environments.
Nuoxing’s commitment to technological advancement, customer-driven customization, and rigorous quality assurance makes them a trusted material partner for global leaders in the advanced coating, electronics, and display industries. By continuously innovating in SiO2 target manufacturing and bonding methods, Nuoxing enables seamless integration with leading sputtering equipment like the Leybold DEMOS400, driving the progress of high-performance, large-area thin films worldwide.
99.99% pure germanium sputtering targets are widely used in the semiconductor and optoelectronics industries. Fuzhou Nuoxin Advanced Material Co., Ltd. (www.nuoxingtech.cn) specializes in producing high-quality germanium targets that meet strict thin-film deposition requirements.
Germanium is a semiconductor with a bandgap of about 0.66 eV, offering excellent electrical and optical properties. Its sputtering targets are used in physical vapor deposition (PVD) processes, where energetic ions bombard the target in a vacuum chamber. This causes germanium atoms to eject and deposit as a thin film on substrates like silicon wafers. This process allows precise control over film thickness, composition, and microstructure, essential for device performance.
Nuoxin’s germanium targets provide high purity and uniformity, ensuring superior film quality and device yield. Applications include high-speed transistors, photodetectors, infrared sensors, multi-junction solar cells, and MEMS devices.
By delivering reliable 99.99% germanium sputtering targets, Fuzhou Nuoxin supports advanced semiconductor and optoelectronic manufacturing, driving innovation and enhanced performance.
@PVDCoatingProcess@PHOTONICS54 Titanium dioxide (TiO₂) sputtering targets are key materials used in thin film deposition, especially in electronics and optics. TiO₂ films have excellent optical properties, chemical stability, and durability, making them ideal for coatings and devices.
Production Process
The production starts with high-purity TiO₂ powder, usually made by two main methods:
Sulfate Process: Ilmenite ore is treated with sulfuric acid to produce TiO₂ powder. This method can produce anatase or rutile forms but generates more waste.
Chloride Process: Rutile ore is chlorinated to form titanium tetrachloride (TiCl₄), which is purified and oxidized to create high-purity rutile TiO₂ powder. This process is cleaner and yields better quality.
After powder preparation, the TiO₂ is pressed into a compact shape, then sintered at high temperatures (1200–1500°C) to increase density and strength. Finally, the target is machined and polished for use in sputtering equipment.
Applications
TiO₂ sputtering targets are used to deposit thin films for:
Optical coatings: Anti-reflective layers and filters.
Display panels: Improving brightness and contrast.
Photocatalysis: Self-cleaning and pollution control surfaces.
Protective coatings: Corrosion resistance on electronics and glass.
Solar cells and sensors: Enhancing efficiency and sensitivity.
SiAl (Silicon-Aluminum) sputtering targets are key materials used in physical vapor deposition (PVD) to produce silicon oxide (SiO2) and silicon nitride (Si3N4) thin films. These films are vital in industries like automotive and architectural glass, flat panel displays, and thin-film solar cells.
Typically, SiAl targets contain about 90% silicon and 10% aluminum with high purity (>99.8%). The aluminum helps improve sputtering stability but must be balanced to avoid micro-arcing caused by aluminum oxide formation. Targets are made as dense, crack-free cylindrical rods, often several meters long, bonded to backing tubes without indium for durability.
During sputtering, SiAl targets deposit films in reactive atmospheres (oxygen or nitrogen). The difference in sputtering yields of Si and Al affects film composition, requiring precise process control. Applications include scratch-resistant glass coatings, display panels, solar cells, and barrier layers on polymers.
SiAl targets offer high purity, stable operation, and uniform large-area coating, making them essential for modern thin-film technologies.
Titanium silicate sputtering targets are specialized materials used primarily in thin film deposition processes such as Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD). Their main uses include:
Semiconductor Industry: Titanium silicate targets are employed to deposit thin films with precise composition and high purity on semiconductor wafers. These films serve as dielectric layers, diffusion barriers, or functional coatings in integrated circuits and microelectronic devices.
Display Technology: They are used to create thin films for flat-panel displays, including LCD and OLED screens, where uniformity and optical clarity are critical.
Optical Coatings: Titanium silicate films produced by sputtering targets provide protective and anti-reflective coatings on lenses, mirrors, and other optical components due to their excellent transparency and durability.
Protective and Decorative Surface Coatings: The sputtered titanium silicate layers enhance surface hardness, corrosion resistance, and aesthetic appeal on various substrates, including metals and glass.
Advanced Material Fabrication: High-purity titanium silicate targets enable the production of films with controlled microstructure and composition, which are essential for research and development in nanotechnology and materials science.
These targets are available in different purity grades (from 99% to 99.999%) to meet the stringent requirements of high-tech industries. Their use ensures high-quality thin films with excellent adhesion, uniformity, and functional properties necessary for modern electronic, optical, and protective applications.
IGZO (Indium Gallium Zinc Oxide) Targets
Production Process:
IGZO targets are composed of a mixture of indium oxide (In2O3), gallium oxide (Ga2O3), and zinc oxide (ZnO) powders. The process involves several key steps:
Powder Preparation and Mixing: High-purity nano powders of In2O3, Ga2O3, and ZnO (purity > 99.99%) are mixed in atomic ratios typically ranging from In:Ga:Zn = 1:1:1 to 1:1:2. These powders are ball-milled for 12 to 18 hours, often in the presence of ethanol, to achieve a homogeneous mixture.
Granulation and Pressing: A binding agent such as polyvinyl alcohol (PVA) is added (usually 1-5% by weight) to the powder mixture to facilitate granulation. The granulated powder is then pressed into a mold under pressures ranging from 1 MPa to 80 MPa, depending on the stage, to form a compact "biscuit."
Cold Isostatic Pressing: The pressed biscuit undergoes cold isostatic pressing at pressures around 200-270 MPa to increase density and uniformity, achieving a relative density of approximately 55%-60%.
Sintering: The compact is sintered in an oxygen atmosphere at temperatures between 1200°C and 1550°C for several hours (typically 4 to 6 hours). The temperature is carefully controlled during heating and cooling to avoid defects. The sintered target achieves a high relative density (~98%) and uniform microstructure.
This detailed process ensures the IGZO target has the required density, purity, and composition uniformity for effective sputtering use.
Main Applications:
IGZO targets are primarily used to deposit IGZO thin films via sputtering in the manufacture of:
Thin-film transistors (TFTs) for displays, especially in high-resolution LCD and OLED panels.
Transparent conductive oxide (TCO) layers in electronic devices.
Sensors and flexible electronics requiring high electron mobility and optical transparency.
The manufacturing process of tungsten sulfide (WS₂) sputtering targets primarily involves powder synthesis and sintering, followed by bonding to a backing plate for use in sputtering systems:
Powder Preparation and Synthesis: High-purity tungsten and sulfur precursors are reacted, typically in a vacuum environment to minimize oxidation and contamination. This reaction is exothermic and must be carefully controlled to maintain the desired stoichiometry and purity (99.95–99.999%) of WS₂ powders. The powders are then finely milled with strict contamination control1.
Sintering via Vacuum Hot Press: The WS₂ powders are loaded into graphite molds and subjected to high temperature and pressure in a vacuum hot press. The vacuum reduces oxidation risk, while heat and pressure densify the powders into a near-net shape target. Thermal profiles are carefully monitored to avoid cracking due to induced stresses13.
Machining and Bonding: After sintering, the target is ground and machined to precise dimensions. Because WS₂ is brittle and has low thermal conductivity, the target is usually bonded to a copper or molybdenum backing plate to provide mechanical support and thermal management during sputtering13.
Regarding the main usage of tungsten sulfide sputtering targets:
Thin Film Coatings: WS₂ targets are used in physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes to create thin films with excellent lubricating properties. These films provide solid lubrication with very low friction, stable over a broad temperature range from cryogenic to high temperatures, including vacuum and space conditions23.
Semiconductor Industry: WS₂ sputtering targets are utilized to deposit thin films in semiconductor device fabrication, contributing to advanced transistors and flexible electronics due to their electrical transport properties26.
Mechanical and Automotive Parts: The WS₂ coatings are applied on engine parts, shafts, bearings, pistons, and gears to reduce wear and friction, enhancing durability and performance in automotive and aerospace applications26.
Advanced Technologies: WS₂ thin films are used in space exploration equipment, photovoltaic cells, and other electronic devices where thermal stability, lubricity, and electrical performance are critical246.
In summary, tungsten sulfide sputtering targets are manufactured by high-purity powder synthesis followed by vacuum hot pressing and bonding to backing plates. Their main applications lie in producing lubricious, wear-resistant thin films for semiconductor devices, automotive and aerospace components, and advanced coating technologies requiring stable performance under extreme conditions.
hashtag#Tungsten hashtag#sputtering hashtag#deposition hashtag#thinfilm hashtag#coating hashtag#WS2 hashtag#semiconductor hashtag#material
3N5 purity SiB3 sputtering target bonded with backing plate manufactured by Nuoxing Optoelectronics Material Co.,Ltd. (Fuzhou Nuoxin Advanced Material Co.,Ltd.). Silicon Boride target is still in the stage of research and test. In the future, it will be used in Semiconductor manufacturing, Optical thin films, Anti reflection coating and Nanotechnology research.
Merry Christmas! Nuoxin Advanced Materials Co.,Ltd. thank all customers for all year support! Hereby, we wish you a Merry Christmas and a Happy New Year! Cheers for the wonderful year and an amazing one ahead of us!
This is the graphnite rotatable (rotary) sputtering target. Nuoxin Advanced Material own mature manufacturing technique of rotatable sputtering target, our totary targets are regularly ordered by European and American PVD deposions thin film / optical coating mills.
何雪梅
Nuoxing Advanced Material Co., Ltd. (Nuoxing Technology) is a renowned high-tech company specializing in the research, development, and production of advanced coating materials, including high purity silicon dioxide (SiO2) sputtering targets. With over two decades of experience and a strong foundation in innovation, Nuoxing provides custom solutions for complex thin-film deposition applications across flat panel displays, semiconductors, optoelectronics, photovoltaics, and more.
High purity SiO2 targets produced by Nuoxing are characterized by their superior chemical and structural uniformity, extremely low levels of impurities, and dense microstructure. These attributes are crucial for achieving films with high transparency, strong adhesion, and optimal dielectric properties, meeting the demands of next-generation electronic and optical devices. Quality is further ensured through rigorous analytical controls and the use of proprietary purification and shaping technologies.
A significant application for Nuoxing's SiO2 sputtering targets is their integration with the Leybold DEMOS400 series backplate. Bonding the SiO2 target to the DEMOS400 backplate requires precision to ensure uniform heat dissipation and mechanical stability during thin film deposition processes, such as physical vapor deposition (PVD). Nuoxing utilizes advanced bonding techniques and tailor-made backplates to guarantee compatibility with Leybold systems, offering strong adhesion, enhanced thermal conductivity, and long operational lifespans. This results in superior process reliability, higher yields, and consistent film properties demanded by modern manufacturing environments.
Nuoxing’s commitment to technological advancement, customer-driven customization, and rigorous quality assurance makes them a trusted material partner for global leaders in the advanced coating, electronics, and display industries. By continuously innovating in SiO2 target manufacturing and bonding methods, Nuoxing enables seamless integration with leading sputtering equipment like the Leybold DEMOS400, driving the progress of high-performance, large-area thin films worldwide.
#sputteringtargets #deposition #vacummcoating #magnetrondeposition #optical #thinfimmaterial #rareearth #metal #commpoundmaterial #semiconductor #photonics #optics #evaporationmaterials #PVDcoating #SiO2 #LeyboldDEMOS400 #element
10 months ago | [YT] | 0
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何雪梅
High-Purity 99.99% Germanium Sputtering Targets — Fuzhou Nuoxin Advanced Material Co., Ltd.
99.99% pure germanium sputtering targets are widely used in the semiconductor and optoelectronics industries. Fuzhou Nuoxin Advanced Material Co., Ltd. (www.nuoxingtech.cn) specializes in producing high-quality germanium targets that meet strict thin-film deposition requirements.
Germanium is a semiconductor with a bandgap of about 0.66 eV, offering excellent electrical and optical properties. Its sputtering targets are used in physical vapor deposition (PVD) processes, where energetic ions bombard the target in a vacuum chamber. This causes germanium atoms to eject and deposit as a thin film on substrates like silicon wafers. This process allows precise control over film thickness, composition, and microstructure, essential for device performance.
Nuoxin’s germanium targets provide high purity and uniformity, ensuring superior film quality and device yield. Applications include high-speed transistors, photodetectors, infrared sensors, multi-junction solar cells, and MEMS devices.
By delivering reliable 99.99% germanium sputtering targets, Fuzhou Nuoxin supports advanced semiconductor and optoelectronic manufacturing, driving innovation and enhanced performance.
#sputteringtargets #depositioncoating #vacummcaoting #magnetrondeposition #optical#thinfimmaterial #rareearth #metal #commpoundmaterial #semiconductor #photonics #optics #evaporationmaterials #PVDcoating #ITO #IGZO #element #Ge #Gemanium
10 months ago | [YT] | 0
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何雪梅
@PVDCoatingProcess @PHOTONICS54 Titanium dioxide (TiO₂) sputtering targets are key materials used in thin film deposition, especially in electronics and optics. TiO₂ films have excellent optical properties, chemical stability, and durability, making them ideal for coatings and devices.
Production Process
The production starts with high-purity TiO₂ powder, usually made by two main methods:
Sulfate Process: Ilmenite ore is treated with sulfuric acid to produce TiO₂ powder. This method can produce anatase or rutile forms but generates more waste.
Chloride Process: Rutile ore is chlorinated to form titanium tetrachloride (TiCl₄), which is purified and oxidized to create high-purity rutile TiO₂ powder. This process is cleaner and yields better quality.
After powder preparation, the TiO₂ is pressed into a compact shape, then sintered at high temperatures (1200–1500°C) to increase density and strength. Finally, the target is machined and polished for use in sputtering equipment.
Applications
TiO₂ sputtering targets are used to deposit thin films for:
Optical coatings: Anti-reflective layers and filters.
Display panels: Improving brightness and contrast.
Photocatalysis: Self-cleaning and pollution control surfaces.
Protective coatings: Corrosion resistance on electronics and glass.
Solar cells and sensors: Enhancing efficiency and sensitivity.
#TitaniumDioxide #TiO2 #SputteringTargets #ThinFilm #OpticalCoatings #DisplayTechnology #Photocatalysis #SolarCells #MaterialScience #AdvancedMaterials #Nanotechnology #SurfaceCoatings #Electronics #CleanEnergy #Manufacturing #TechInnovation
10 months ago | [YT] | 0
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何雪梅
SiAl (Silicon-Aluminum) sputtering targets are key materials used in physical vapor deposition (PVD) to produce silicon oxide (SiO2) and silicon nitride (Si3N4) thin films. These films are vital in industries like automotive and architectural glass, flat panel displays, and thin-film solar cells.
Typically, SiAl targets contain about 90% silicon and 10% aluminum with high purity (>99.8%). The aluminum helps improve sputtering stability but must be balanced to avoid micro-arcing caused by aluminum oxide formation. Targets are made as dense, crack-free cylindrical rods, often several meters long, bonded to backing tubes without indium for durability.
During sputtering, SiAl targets deposit films in reactive atmospheres (oxygen or nitrogen). The difference in sputtering yields of Si and Al affects film composition, requiring precise process control. Applications include scratch-resistant glass coatings, display panels, solar cells, and barrier layers on polymers.
SiAl targets offer high purity, stable operation, and uniform large-area coating, making them essential for modern thin-film technologies.
#sputtering #target #Silicon #aluminum #SiAl #coating #thinfilm
11 months ago | [YT] | 0
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何雪梅
Titanium silicate sputtering targets are specialized materials used primarily in thin film deposition processes such as Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD). Their main uses include:
Semiconductor Industry: Titanium silicate targets are employed to deposit thin films with precise composition and high purity on semiconductor wafers. These films serve as dielectric layers, diffusion barriers, or functional coatings in integrated circuits and microelectronic devices.
Display Technology: They are used to create thin films for flat-panel displays, including LCD and OLED screens, where uniformity and optical clarity are critical.
Optical Coatings: Titanium silicate films produced by sputtering targets provide protective and anti-reflective coatings on lenses, mirrors, and other optical components due to their excellent transparency and durability.
Protective and Decorative Surface Coatings: The sputtered titanium silicate layers enhance surface hardness, corrosion resistance, and aesthetic appeal on various substrates, including metals and glass.
Advanced Material Fabrication: High-purity titanium silicate targets enable the production of films with controlled microstructure and composition, which are essential for research and development in nanotechnology and materials science.
These targets are available in different purity grades (from 99% to 99.999%) to meet the stringent requirements of high-tech industries. Their use ensures high-quality thin films with excellent adhesion, uniformity, and functional properties necessary for modern electronic, optical, and protective applications.
#Titanium #sputtering #coating #target #Material #Silicon #film #silicate #display
11 months ago | [YT] | 0
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何雪梅
IGZO (Indium Gallium Zinc Oxide) Targets
Production Process:
IGZO targets are composed of a mixture of indium oxide (In2O3), gallium oxide (Ga2O3), and zinc oxide (ZnO) powders. The process involves several key steps:
Powder Preparation and Mixing: High-purity nano powders of In2O3, Ga2O3, and ZnO (purity > 99.99%) are mixed in atomic ratios typically ranging from In:Ga:Zn = 1:1:1 to 1:1:2. These powders are ball-milled for 12 to 18 hours, often in the presence of ethanol, to achieve a homogeneous mixture.
Granulation and Pressing: A binding agent such as polyvinyl alcohol (PVA) is added (usually 1-5% by weight) to the powder mixture to facilitate granulation. The granulated powder is then pressed into a mold under pressures ranging from 1 MPa to 80 MPa, depending on the stage, to form a compact "biscuit."
Cold Isostatic Pressing: The pressed biscuit undergoes cold isostatic pressing at pressures around 200-270 MPa to increase density and uniformity, achieving a relative density of approximately 55%-60%.
Sintering: The compact is sintered in an oxygen atmosphere at temperatures between 1200°C and 1550°C for several hours (typically 4 to 6 hours). The temperature is carefully controlled during heating and cooling to avoid defects. The sintered target achieves a high relative density (~98%) and uniform microstructure.
This detailed process ensures the IGZO target has the required density, purity, and composition uniformity for effective sputtering use.
Main Applications:
IGZO targets are primarily used to deposit IGZO thin films via sputtering in the manufacture of:
Thin-film transistors (TFTs) for displays, especially in high-resolution LCD and OLED panels.
Transparent conductive oxide (TCO) layers in electronic devices.
Sensors and flexible electronics requiring high electron mobility and optical transparency.
IGZO films offer excellent electrical performance, transparency, and stability, making them ideal for next-generation display and semiconductor technologies.
#sputter #IGZO #target #coating #semiconductor #optical #deposit #thinfilm
1 year ago | [YT] | 0
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何雪梅
The manufacturing process of tungsten sulfide (WS₂) sputtering targets primarily involves powder synthesis and sintering, followed by bonding to a backing plate for use in sputtering systems:
Powder Preparation and Synthesis: High-purity tungsten and sulfur precursors are reacted, typically in a vacuum environment to minimize oxidation and contamination. This reaction is exothermic and must be carefully controlled to maintain the desired stoichiometry and purity (99.95–99.999%) of WS₂ powders. The powders are then finely milled with strict contamination control1.
Sintering via Vacuum Hot Press: The WS₂ powders are loaded into graphite molds and subjected to high temperature and pressure in a vacuum hot press. The vacuum reduces oxidation risk, while heat and pressure densify the powders into a near-net shape target. Thermal profiles are carefully monitored to avoid cracking due to induced stresses13.
Machining and Bonding: After sintering, the target is ground and machined to precise dimensions. Because WS₂ is brittle and has low thermal conductivity, the target is usually bonded to a copper or molybdenum backing plate to provide mechanical support and thermal management during sputtering13.
Regarding the main usage of tungsten sulfide sputtering targets:
Thin Film Coatings: WS₂ targets are used in physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes to create thin films with excellent lubricating properties. These films provide solid lubrication with very low friction, stable over a broad temperature range from cryogenic to high temperatures, including vacuum and space conditions23.
Semiconductor Industry: WS₂ sputtering targets are utilized to deposit thin films in semiconductor device fabrication, contributing to advanced transistors and flexible electronics due to their electrical transport properties26.
Mechanical and Automotive Parts: The WS₂ coatings are applied on engine parts, shafts, bearings, pistons, and gears to reduce wear and friction, enhancing durability and performance in automotive and aerospace applications26.
Advanced Technologies: WS₂ thin films are used in space exploration equipment, photovoltaic cells, and other electronic devices where thermal stability, lubricity, and electrical performance are critical246.
In summary, tungsten sulfide sputtering targets are manufactured by high-purity powder synthesis followed by vacuum hot pressing and bonding to backing plates. Their main applications lie in producing lubricious, wear-resistant thin films for semiconductor devices, automotive and aerospace components, and advanced coating technologies requiring stable performance under extreme conditions.
hashtag#Tungsten hashtag#sputtering hashtag#deposition hashtag#thinfilm hashtag#coating hashtag#WS2 hashtag#semiconductor hashtag#material
1 year ago | [YT] | 0
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何雪梅
3N5 purity SiB3 sputtering target bonded with backing plate manufactured by Nuoxing Optoelectronics Material Co.,Ltd. (Fuzhou Nuoxin Advanced Material Co.,Ltd.). Silicon Boride target is still in the stage of research and test. In the future, it will be used in Semiconductor manufacturing, Optical thin films, Anti reflection coating and Nanotechnology research.
1 year ago | [YT] | 0
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何雪梅
Merry Christmas! Nuoxin Advanced Materials Co.,Ltd. thank all customers for all year support! Hereby, we wish you a Merry Christmas and a Happy New Year! Cheers for the wonderful year and an amazing one ahead of us!
1 year ago | [YT] | 0
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何雪梅
This is the graphnite rotatable (rotary) sputtering target. Nuoxin Advanced Material own mature manufacturing technique of rotatable sputtering target, our totary targets are regularly ordered by European and American PVD deposions thin film / optical coating mills.
1 year ago | [YT] | 0
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